PCB Assembly Express Develops Next Generation Quoting and Ordering System
PCB Assembly Express, a company in Lake Oswego, OR that provides quality assembly from prototype to high volume, announces new PCB services and partnerships, along with a next generation website to reflect them. ZESTRON Europe promotes Martin Königer to Senior Process Engineer
ZESTRON Europe, the leading global provider of precision cleaning products and services for the electronics manufacturing industry, is pleased to announce the recent promotion of Mr. Martin Königer to “Senior Process Engineer.” High Demand For Scorpion, Essemtec’s New Dispensing System
Since the premier of the Scorpion at productronica 2011 in Munich, Essemtec has noted a record high in demand – and rightly so! Due to its outstanding price-performance ratio, the new dispensing machine is among the best dispensers in the world. Its accuracy of +/- 25 μm is extraordinary and it can dispense up to 100,000 dots per hour. ACD Reports Record Sales for 2011
ACD, a leading supplier to the electronics industry, announces a 21 percent increase in sales over 2010. 2011 marks ACD’s highest sales to date in the company’s 27-year history. Computrol Picks Up Its Placement with an Assembléon AX-501 Pick-and-Place Unit
Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronics manufacturing services to OEMs, recently invested in an Assembléon AX-501 pick-and-place system with a 47-tray TEM unit. 
RAINBOW TECHNOLOGY READY TO REVOLUTIONISE PRINTED CIRCUIT BOARD MANUFACTURE
The Rainbow Process represents a breakthrough for the electronics industry by incorporating coating, imaging and developing of PCBs in one compact, automated unit which promises to make board production faster, easier and more profitable. FlexLink launches new modular wide belt conveyor
The new modular plastic belt conveyor system from FlexLink is the efficient solution for the transportation of large individual items and flows of smaller products. Now Available - Placing Force Measurement Option on FLX2011
New technologies such as package on package (PoP) component assembly or bare die assembly on COB applications, as well as the optimization of material consumption demands for increased knowledge of the actual placement forces. Electrolube Airdusters and Freezer Sprays To Reduce CO2 Emissions by 99.5%
The electro-chemicals manufacturer, Electrolube, holds environmental responsibility at the core of its ethos so when the opportunity came to utilise a low global-warming-potential (GWP) propellant in some of its key products, the company quickly recognised the benefits this would create for its customers and the environment, without any compromise in performance. Demanding PCB process requires a more durable label solution
First, PCB manufacturers are switching to Tin Copper (SnCu) solder in wave soldering process’s as a cost cutting measure and moving away from silver based alloys. The Tin Copper alloy has a higher melting point which requires temperatures up to 280°C for processing. This increase in temperature may cause yellowing of the label or adhesive failure. If the label turns yellow it may not scan properly or may not be accepted for aesthetic concerns. | 
