Aqueous Technologies’ Trident Automatic Defluxing System Wins Two 2008 Advanced Packaging Awards
Aqueous Technologies Corp. announces that Trident, its fourth-generation automatic defluxing system, was awarded two Advanced Packaging Awards in the categories of Cleaning Equipment and Environmentally Friendly during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco. Kyzen’s AQUANOX A4241 Wins Two 2008 Advanced Packaging Awards
Kyzen, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that its AQUANOX® A4241 PCB and Stencil Cleaner won an Advanced Packaging Award in the category of Cleaning Chemistries and was named as a first finalist in the category of Flip Chip Equipment & Materials during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco. BTU’s Pyramax 100 Reflow Oven Wins 2008 Advanced Packaging Award
BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, today was presented with an Advanced Packaging Award in the Reflow Equipment category for its Pyramax 100 reflow oven. MIRTEC Receives 2008 Advanced Packaging Award for Their MV-7L In-Line AOI Machine
MIRTEC, a global leader in Automated Optical Inspection Technology, announces that its MV-7L In-Line AOI System was named First Finalist in the category of Inspection Equipment & Services during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco. Romania to Host Cemconex Advanced Technology Day
Cemconex, a one day advanced technology conference and table-top exhibition for CEMs and OEMs, is to be held in Timisoara, Romania on October 17th 2008. Featuring a series of high standard workshops and technical papers, the event will address key topics such as reliability, flexible circuits, traceability and automotive applications. 
MANNCORP ‘HI OUTPUT’ TURNKEY LINE TARGETS MID TO HIGH-VOLUME FLEXIBLE SMT ASSEMBLY
An automated turnkey line now offered by Manncorp includes a 4-head pick and place that provides assets of speed, flexibility and fast changeover. The “Hi Output Line” also includes an inline fully automatic stencil printer, an 8-zone reflow oven and pass-through conveyor, priced below $180,000 complete. Krayden Inc. Now Offers a Line of Products for LED Lighting Manufacturers
Krayden, Inc., a leading distributor of engineered materials, now offers a line of Dow Corning products for LED lighting manufacturers, including LED Protection and Assembly Products, LED Packaging Products, and LED Thermal Management. PROMATION Completes Integration For Heavy Assembly
PROMATION announces that it has recently completed the full integration of a progressive assembly line to assemble and build 500+ lb control cabinets. ECT INTRODUCES THE NEXT GENERATION POGO® SERIES AT SEMICON WEST
Everett Charles Technologies (ECT) Contact Products Group (CPG) introduced its revolutionary new line of Pogo contacts for Semiconductor Test at Semicon West in San Francisco. “ADHERE” LAUNCHES PREMIER CYANOACRYLATE “INSTANT” ADHESIVE
Intertronics are pleased to announce a significant new range of professional grade cyanoacrylate “instant” adhesives under their “adhere” brand - superior quality, high purity single part adhesives which have numerous applications in all aspects of high technology, high performance assembly. | 
