Finetech International User Meeting for Micro Assembly
Finetech will hold the International User Meeting for Micro Assembly in Berlin on September 30, 2010 for users, customers and specialists working in the field of advance packaging. It is a brilliant opportunity to meet users, customers, prospects, industry representatives and academics for a prolific exchange of experiences. The agenda includes lectures and presentations of the latest equipment and application solutions and a joint evening program. The second conference day is dedicated to discussing individual topics with Finetech product managers and application engineers. Registration for this event is completely free of charge and forms must be completed and returned by September 15, 2010. Go to http://www.finetech.de to obtain your registration fax and to see the preliminary agenda.
Venue: Berlin
Date: From 30 September 2010 to 1 October 2010