Publication date: 02 September 2010
The SMTA and Chip Scale Review magazine are pleased to announce Peter Ramm, Fraunhofer EMFT, as the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Early Bird conference pricing is in effect until September 10, 2010, after which registration prices will go up $100.
Peter will present "The European 3D Technology Platform for Heterogeneous Systems" at the Kick-Off Reception on Tuesday, October 12 from 5:00 - 6:30pm. Mr. Ramm will discuss the European 3D technology platform that has been established within the EC funded e-CUBES project, focusing on the requirements coming from heterogeneous systems.
Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The event is sponsored by Amkor Technology, EV Group, NEXX Systems, Pac Tech USA, and Technic Inc.
Visit http://www.iwlpc.com for more information.
