Publication date: 02 September 2010
The choice of solderable finishes applied to surface mount boards can have a significant effect on the assembly yield, bow and twist, misplacement, open joints and cost of the final circuit. Tin/lead and lead free solder levelled board are in the minority gold, tin, silver and OSP have been growing in popularity but nothing solders like solder!! The session will demonstrate all the options available and how to evaluate the best surface finish for assembly. Bob Willis will show some of the test methods used in production to test surface finishes along with some of his own no cost techniques. During the webinar delegates will see different process failure modes and be able to judge what is cosmetic and if reliability may be affected.
Topics:
Review of solderable finishesCurrent supplier base for finishesAssembly and design advantages/ disadvantagesBall grid array and fine pitch requirementsProcess conditions for assembly processSpecification of solderable finishesCost of different finishesAssembly yield improvementsReliability of solder joints on alternative finishesProcess rejects and joint failure in productionPractical solderability testing of finishes
Who Should attend:
Ideal for process and design engineers evaluating or fault finding different PCB finishes to improve existing yields or to implement for lead-free production. Beneficial to purchasing staff to better understand the products and materials and their availability in the industry.
Presented by Bob Willis
