Publication date: 27 October 2011
There are numerous trade shows for the electronics manufacturing sector. Some are new, some have been around for a long time, but none of them have the sheer size and presence commanded by Productronica in Munich.
Productronica is run every two years, on an alternating cycle with its sister show electronica. It claims to be the only place in the world where you’ll find the entire value chain for electronics manufacturing under a single roof. It is one of the few truly international trade shows remaining in our industry.
What this amounts to is approximately 1250 exhibitors (an increase of 15% on last year), and and expected excess of 32,000 visitors– again an increase of 15% on last year will descend on Munich between the 15th and the 18th of November to see the latest innovations in the world of electronics manufacturing.
Below we take a cross-section of highlighted announcements from this year’s show!
Hall A4, Booth 418
Kyzen, the world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that its innovative AQUANOX® A4638 Advanced Packaging Cleaning Chemistry will make its European debut in Hall A4, Booth 418 at the upcoming Productronica International Trade Fair.
AQUANOX® A4638 is an industry-leading engineered electronic assembly and advanced packaging cleaning solution. It is the first product designed and specifically optimized for cleaning lead-free water soluble flux residues from advanced packaging devices and assemblies.
A4638 is designed for particularly high temperature water soluble residues which allows for lower cost of ownership and high throughputs. This product was designed to operate in cost-sensitive, high volume water soluble flux operations. It is a drop in replacement that does not require any additional capital expenditures by the user.
A4638 offers users the ability to be environmentally friendly as it was specifically designed to be green: non-hazardous, very low VOC and safe for workers and the environment. It replaces legacy technology that is often corrosive and hazardous, increasing safety costs as well as shipping and disposal costs. The AQUANOX® A4638 is a pioneering, non-hazardous, biodegradable aqueous solution which contains no CFC’S or HAP’s.
For more information about this revolutionary solution, feel free to speak with a Kyzen representative in Hall A4, Booth 418 during Productronica 2011 or visit www.kyzen.com.
Hall A2, booth #461
ZESTRON, the worldwide leading supplier of high precision cleaning media for the electronics manufacturing industry, will present its latest generation of pH-neutral defluxing agents for PCB’s and Power Modules at this year’s Productronica in Munich, Germany (Hall A2, booth #461).
As part of this latest development, ZESTRON will launch its newest PCB cleaning agent VIGON® N 600. After presenting the world’s first pH-neutral defluxing agent for electronic assemblies in 2009, Zestron devoted extensive research and development resources to this area. As a result, the new product VIGON® N 600 provides excellent compatibility with sensitive materials, such as aluminum, copper, brass, nickel, polymers as well as barcode labels.
VIGON® N 600 is water-based and demonstrates excellent cleaning performance in spray-in-air equipment and dip tank processes. It can be used at short contact times and low application concentrations of 15 to 20%. Due to its pH-neutral formulation, VIGON® N 600 is another step towards implementing an environmentally friendly cleaning process.
For more information, please visit us at Productronica 2011 or contact info@zestron.com.
Hall A4 booth 271
With a number of products already showcasing for the first time at Productronica, leading global electro-chemical manufacturer, Electrolube, has announced it will use the show as a springboard to launch two new resin products.
Silver loaded epoxy resin, ESLE-10 and underfill resin ES501 will be showcased for the first time at the leading electronic production trade fair. ESLE-10 is a one part silver loaded epoxy resin used for conductive bonding, offering excellent mechanical bonds and electrical conductivity making it suitable for a number of applications including prototype and repair.
Unlike many other resins, ESLE-10 is a single part system that has an excellent adhesion to a number of substrates and can be used as a conductive bond between solder free surface mount connections, solder repairs, static discharge and grounding or general conductive adhesions.
With a high bond strength and wide operating temperature of -30 to +130 °C, which is compliant to RoHS, ESLE-10 electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of <0.0005 ohm-cm.
ELSE-10 will be showcased alongside the innovative underfill resin ES501 designed to improve adhesion strength of devices during mechanical stress. The product offers confidence to users that during the process, degrading of the thermal cycle performance will not be compromised. With its high flexibility it provides enhanced repairability and is an ideal product for high volume assembly process. Although not yet launched in Europe, the product is already gaining interest within the industry because of its impressive features of fast, void-free underfill of area array devices, it ability to be re-worked and its snap curable properties. Adding to these benefits ES501 has excellent adhesion to substrates and outstanding electrical characteristics.
With typical curing times of 35-40 minutes at 90°C or just 3 minutes at 150°C the product is a good universal underfill resin. Both of these products will be available to view at Electrolube stand Hall A4 Booth 271 at Productronica or visit the website: www.electrolube.com for further information.
Hall A2, Booth 205
Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, will debut the new RoadRunner3 inline programming system, the next generation of the world’s only just-prior-to-placement programming solution in Hall A2, Booth 205 at the upcoming Productronica International Trade Fair.
With its Factory Integration Software (FIS), RoadRunner3 streamlines the production process and eliminates operator errors through its connection to a firm’s manufacturing execution system (MES) or other shop-floor control software and through that connection all the way to the firm’s enterprise resource planning (ERP) system.
It is a versatile and configurable high speed automated inline programming feeder that mounts directly onto an SMT machine without consuming additional floor space or altering the production line—easily integrates into existing SMT processes. By removing unprogrammed Flash memory devices from tape, the system programs four devices in parallel and then delivers the programmed parts to the pickup point of the placement machine.
RoadRunner3 with Factory Integration Software modules FIS Remote and FIS Track allows customers to manage and monitor the programming process. The FIS Remote software module eliminates operator errors through automated job selection and job downloads. The FIS Track software module enables data-driven decision making to optimize the programming process and minimize scrap and rework costs through automated collection and export of programming results. To ensure optimal equipment utilization, FIS Remote and FIS Track sends e-mail alerts if the system needs maintenance or when yields drop below a set threshold.
RoadRunner3 features FlashCORE III, the world’s fastest Flash programming architecture available on the market today for programming high-density Flash memories such as e.MMC, SD and NAND Flash. FlashCORE III is the highest-quality proven solution for programming Microcontrollers, EPROM, EEPROM, NOR Flash and many others.
Data I/O has successfully installed hundreds of RoadRunner systems for Tier 1 companies incorporating programming into their lean manufacturing process. Customers are able to eliminate their inventory of pre-programmed devices, dramatically reduce inventory carrying and rework costs, by using the Just-In-Time programming provided by RoadRunner, as well as recognize a rapid ROI in only a matter of months. “Since its introduction over ten years ago, the RoadRunner platform has programmed over 10 Billion devices and enabled the world’s leading manufacturers of electronic products to streamline their programming process, literally saving millions of dollars while simultaneously increasing production velocity. RoadRunner3 with Factory Integration Software takes streamlining the programming process to the next level by providing a combination of benefits that offline programming and ISP/ICT solutions simply cannot match, including virtually eliminating operator errors, reducing production risks and delivering the lowest cost per programmed part,” said Carl Olson, Director of Engineering at Data I/O.
For further information on Data I/O, please visit www.dataio.com
Hall B2, Booth 211
Miyachi Europe, a leading supplier of resistance welding, laser welding, hot-bar and laser marking products, will be unveiling many new developments including its new MG3-HB premium hot bar monitoring solution at the productronica 2011 trade fair.
On display will be the AWS3 Active Welding System equipped with the new low force MFP25 weld head, the new innovative modular weld head system concept, which now incorporates a wide range of customer requested variations into standard product configurations, improving efficiency, quality and serviceability. Other products to be exhibited include the new 35W Fibre Laser Marker, ML-7340C, the Green Laser Welder ML-8150 and the 1kW Fibre Laser Welder ML-6810.
Miyachi Europe’s famous MG3 Weld Monitor has become the ‘Global Standard’ technology in resistance weld monitoring over the last years, providing precision real-time dynamic measurement of all welding variables. The newly introduced MG3-HB process monitor for hot bar applications features precise force, temperature and displacement measurement with an extended process measuring time of 30 seconds.
The MG3-HB is equipped with all standard MG3 features, including two independent measurement channels, oscilloscope functions, full on-screen SPC capability, integrated clock and date for process reporting and traceability, up to 99 schedules with password protection and multiple language capability. A host of new features will be showcased on Miyachi Europe’s AWS3 Active Welding System, an integrated solution providing process control, monitoring and quality analysis all in one.
The AWS3 is ideal for high volume resistance welding in the automotive, electronics, battery and aerospace industries in particular. Hardware updates have improved process control and adaptive features which now include duty cycle, electrode closing time, squeeze time and weld force. New HMI developments feature the a user friendly touch screen with a larger panel, increased interfaces, new data storage options and twice the screen resolution to allow operators an improved view of the details. The AWS3 also incorporates the latest range of weld head and weld pincers along with the new low force, MFP25, servo head with a linear drive.
Miyachi Europe’s new modular weld head concept will be revealed and demonstrated. The concept, which was designed to give customers the widest possible range of variations while emphasizing quality, efficiency and serviceability, uses a 3D CAD system to manage and standardise feasible variations. The CAD tool considers and combines all relevant technical criteria and suggests a perfect solution out of hundreds of variations. Application experts will be on hand to show how the concept can be used to customise applications.
For more details on Miyachi Europe’s areas of expertise please visit our website at http://www.miyachieurope.com/technologies/
Booth A2:339
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) announces that its latest bond testing and X-ray inspection systems will be exhibited in Booth A2:339 at the Productronica exhibition.Nordson DAGE will showcase its bond testing technology, including the next generation 4000Plus bondtester that represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability.
Alongside other specialized applications Nordson DAGE will showcase its newly developed 4000Plus pad cratering inspection system. This unique patented technique for attaching a test probe to solder bumps or solder paste in order to perform a hot bump pull test is in full accordance with the recently published IPC-9708 test standards for the detection of pad cratering for surface mount and printed circuit board assemblies. Pad cratering has become a major issue with lead-free assemblies and the development of the IPC-9708 standard together with the availability of the 4000Plus hot bump pull test methodology enables product developers to determine the optimum materials for their applications.
Nordson DAGE’s flagship X-ray inspection systems, the XD7600NT Diamond FP and XD7600NT Ruby FP use the latest technology, flat panel detector to provide the highest quality real time X-ray imaging. The unique Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 100 nanometer (0.1µm) feature recognition and up to 10 watts of power, together with the 3 mega pixel longer lifetime CMOS flat panel detector makes these systems the crystal clear choice for the greatest performance and highest magnification of real-time imaging.
For more information, visit www.nordsondage.com.
Hall A2, Booth # 377
MIRTEC, the “Global Leader in Inspection Technology” announces that it will present a comprehensive range of 3D AOI, SPI and LED technologies at their Booth # 377, Hall A2 at Productronica.
Mirtec will exhibit the MV-7 Series 2D/3D In-Line AOI Machine with 15 Mega Pixel ISIS Vision System combined with MIRTEC’s Exclusive 3D Multi-Frequency Quad Moiré Technology. Mirtec’s MV-7 Series In-Line AOI Machine is the world leading technology for inspecting SMT production. It offers advanced Fifteen Mega Pixel Digital Color Camera Technology which provides the ultimate inspection performance and speed. The optional Side Viewer® Camera System provides enhanced inspection capability through the addition of four Side View Digital Color Cameras. Mirtec’s combination of unique 15Mega pixel cameras and Moiré 3D technology sets an unmatchable standard for SMT inspection.
Mirtec’s will also be exhibiting the latest Benchtop enhancement, which is their industry-leading MV-3 AOI System utilizing the unique ISIS camera configuration. The system offers one Top-Down and four angled 10 Mega Pixel cameras with the award-winning Intelli-Beam Laser option, this offers an unrivalled benchtop specification.
The MIRTEC MS-11 In-Line SPI System uses Shadow Free Moiré Phase Shift Imaging Technology and ‘Phase Stepping Image Processing’ to inspect solder paste deposition on PCB’s post-screen print. Far superior to laser SPI technology, the MS-11 will inspect for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11 is configured with an ultra-high-resolution 15 Mega Pixel Camera for enhanced image quality, superior accuracy and high volume speed capability. Image processing based on the Moiré phase shift method is by far the most precise way of post-print solder paste profile inspection. This method projects light in grid or stripe patterns on the solder paste depot. The light pattern is being moved step by step along the depot and a downward looking high resolution CCD camera acquires the resulting images. The MS-11 uses a “shadow-free” construction where both sides of the solder paste depot are being inspected at the same time.
MV-7SB LED BLU & LIGHT Specialized 2- & 3-D Vision Inspector — MIRTEC’s unique 2- and 3-D inspection technology of BLU AOI, optimized with a 15 Mega Pixel high-speed CMOS Main Camera with compound telecentric lens and 3-D Multi-Frequency moiré, offers precision height measurement of LEDs.
Main functions of the MV-7SB include LED alignment that auto inspects the alignment of all LED on BLU array, LED pitch inspection, which auto measures the distance between the center of LEDs. A LED Offset Measure measures ΔX /ΔY/ΔΘ of the LEDs. Also included is the LED Shift Inspection that features intuitive display of precise measurements, LED cold/over solder, inspection that detects insufficient, over soldering and even cold soldering of LEDs as well as color inspection by red, green and blue light. All data can be saved in a variety of formats including HTML, TXT, JPEG and EXCEL.
The unique LED inspection system is able to detect LED appearance defects, missing components, wrong components, cold/ insufficient/excessive solder, lift-leads, bridges, breakage, Manhattans, solder balls, turnovers, LED lifts, connector lifts, foreign components, LED aligns and LED angles.
MV-7XP — Implementing 2-D inspection for detection coverage of all failures in the LED Package, the MV-7XP utilizes a 15 Mega Pixel Camera, telecentric compound lenses and high brightness blue LED lighting that offers deep, precise resolution and vision quality to detect chips, wires, bonding, voids and bubbles. MV-7UP — This is a 3-D LED Package specialized dispensing inspector that offers epoxy 3-D height measurement by laser, as well as detecting faults such as voids, bubbles, foreign materials, overflow, underflow, package tilt, ink, front defects and broken packages. Like MIRTEC’s other systems, the MV-7UP uses the company’s unique 15 Mega Pixel camera, telecentric compound lenses and high brightness blue LED lighting.
LED Light Tester — A LED BLU ARRAY specialized inspector, this LED light/current tester system tests while the current flows through a LED array. The system is able to monitor brightness, uniformity and chromaticity while providing statistical data management.
LED Specialized Inspector — The LED Specialized Inspector measures the voltage through LED arrays, checks voltage levels and automatically marks any failed LEDs. As an additional benefit, a full data report is created for each batch.
Mirtec will be conjoined with their German distribution partner, pb tec, during Productronica 2011 in Hall A2 Booth #377.
For further information visit: www.mirtec.com
Hall A1, Booth 465
Acculogic GmbH, a global leader in electronic production test solutions, will highlight its leading test technologies in Hall A1, Booth 465 at the upcoming Productronica International Trade Fair.
Acculogic will showcase its FLS 980Dxi Flying Scorpion™, the only patented double-sided, multi-probe (22) flying probe system with 3-D probing, analog, digital and boundary scan test capability on all probes (top- and bottom-side).
Shrinking component sizes and denser packaging technologies are posing new challenges to test. The FLS980Dxi™ uses closed-loop linear motor drives and joystick-like variable angle probe modules (0 to 6°) to maximize physical access and guarantee repeatable probing of today’s small device geometries, including fine-pitch devices and 0201 and 01005s packages.
Using the patented vectorless test suite, PinScan™, the FLS900 series detects open-pin and orientation faults on digital devices, polarized caps and connectors. New features and enhancements to the system to be demonstrated during the show include:
• New Fixed angle probe modules (BPM700)• New ThermoScan™ • New TraceScan™ • New LaserScan™• New High resolution camera • New NanoScan™ • New REScan™ – Reverse Engineering
Also on display at the show, the latest version of Acculogic’s ScanNavigator™ (powered by Victory™) software that offers full support for IEEE1149.6 and IEEE1149.7 extensions to the IEEE1149.1 standard. The ScanNavigator software is a leading suite of powerful tools for boundary scan test development based on the original JTAG standard, IEEE 1149.1. The new version of ScanNavigator has been extended to support the latest boundary scan technology for the testing of high-speed buses and interfaces such as LVDS, Fiber Channel, Gigabit Ethernet and more.
Acculogic’s ScanNavigator Integrated Boundary Scan Test and Programming Environment consists of test, device programming and run-time modules that use Microsoft’s .NET technology and XML to simplify test generation and , increase productivity. ScanNavigator integrates reduced access test, device programming and diagnostic databases with Acculogic’s testability and coverage analysis tools. Based on the premise that all boundary scan test and onboard programming activities rely on a number of common data preparation steps, the ScanNavigator architecture is optimized for data sharing and portability to reduce development time and increase data reuse.
ScanNavigator-dot6 supports IEEE1149.6 as an optional feature that can be incorporated into any ScanNavigator Virtual Interconnect Test (VIT), making the implementation of 1149.6 tests practically transparent to the user.
Acculogic’s iCT7000™ is ideal for electronics assembly manufacturers that require high throughput, test accuracy and proven reliability at lower test costs. The InCircuit Scorpion is a small footprint in-circuit tester that can be configured with up to 2048 all-real (non-multiplexed) channels, a high accuracy analog measurement instrument, and patented Vectorless test techniques for detection of open pins on digital devices. It is available with a number of industry-standard fixture interfaces for preserving current investments and minimizing transition costs.Test capabilities of the InCircuit Scorpion include standard shorts and opens testing; analog value and analog function testing; Vectorless Opens testing using ChipScanTM and CScan™; reduced-access boundary scan testing using Acculogic’s advanced ScanNavigator™ software; fast programming of onboard FLASH and ISP components, and combinational testing using optional off-the-shelf test instruments.For more information about any of Acculogic’s new test systems or services, stop by Hall A1, Booth 465 at the show or visit www.acculogic.com.
Hall A3, booth 358
The new TCQ automatic Tray Changer can replace a component tray in less than five seconds and align it with accuracy better than 50 µm. The 18-bin changer is available for Cobra and Paraquda pick-and-place machines. Essemtec will highlight the new module at the upcoming productronica 2011 exhibition.
TCQ from Essemtec is a compact tray changer featuring flexibility, high speed and accuracy. On average, tray interchange time is less than five seconds and the final position of the tray is reproducible within 50 µm. This is more than sufficient even for the smallest components such as microBGAs.
Trays are stored in a magazine that is equipped with handles and can be replaced quickly. Standard magazines feature 18 or 14 slots, depending on tray thickness. Each slot has room for one standard JEDEC tray; however, the space also can be divided for several smaller trays.
Despite the high exchange speed, TCQ moves each tray carefully and reliably. Speed can be reduced for specific trays that are carrying lightweight components. TCQ is available for Essemtec’s Paraquda and Cobra SMD pick-and-place machines, featuring placement rates up to 21,000 components per hour.Essemtec will premier the fast TCQ Tray Changer at the upcoming productronica exhibition in Munich, Germany. Visit Essemtec in Hall A3, booth 358.
Hall A2, booth 417
CyberOptics Corporation (Nasdaq: CYBE) will introduce QX100™ – AOI Tabletop System equipped with next generation image analysis software, AI2, alongside a range of in-line AOI and advanced SPI systems at Productronica 2011. CyberOptics invites all attendees to visit booth 417 in Hall A2 to catch a first glimpse of the QX100™ as it makes its debut at the New Munich Trade Fair Centre in Munich.
The QX100™ tabletop system embraces CyberOptics’ unique image acquisition solution using the Strobed Inspection Module (SIM) and is capable of inspecting 01005 components and larger at 100cm²/sec, making it the fastest tabletop system the industry has ever witnessed. The sleek QX100™ is powered by AI2 (Autonomous Image Interpretation), a patented next-generation image analysis technique which exploits the latest advances in processor architecture and has been evolved from the ideas upon which CyberOptics’ industry-proven SAM technology is based. AI2 includes a robust statistical modeling engine providing superior defect detection capabilities, lowest false call rates and improved clarity of defect identification through Defect Pixel Marking. Designed to fully support unsupervised and semi-automatic model training, AI2 delivers incredibly fast setup times and a streamlined programming workflow. The QX100™ system is also ideally designed to match production footprint requirements and fully comply with safety standards.
At the show, CyberOptics’ will feature its SE500-D™ Dual Lane SPI system designed with largest board handling capability comparable with major SMT suppliers. With its flexible conveyor configuration, SE500-D™ maximizes production utilization by allowing different products with varying board widths to be run on the same production line. SE500-D™ also supports asynchronous inspection on separate lanes.CyberOptics will also showcase its fast and accurate 3D SPI system, SE500™, built with the ability to inspect the most demanding assemblies at >80 cm²/sec inspection speed without compromising on measurement accuracy and repeatability. The SE500™ system now offers a Dual Illumination option to further improve repeatability and reproducibility as well as reduce outliers in order to cater to high performance market segments such as medical, automotive, aerospace, etc.
Also, on display will be CyberOptics’ multi-award winning QX500™ AOI system which is truly innovative in every sense with a unique image acquisition solution – Strobed Inspection Module (SIM), designed to deliver high-speed inspection matched with exceptional defect coverage and an extremely low false call rate. Winning its third prestigious award since its launch at NEPCON China 2010 speaks volumes about the global recognition that QX500™ has gained in terms of its technological advancements and superior inspection capability. The introduction of strobed white lighting in the QX500™ makes it the only AOI system to provide ‘on-the-fly’ area-scanning inspection at an incredible 200 cm²/sec, setting it apart from other conventional AOI systems.
CyberOptics will also demonstrate its latest interactive SPC software, Process Monitor™, which enables you to manage your production in the most efficient way. It includes comprehensive statistical process control charts to measure process capability and realize significant improvement in your overall process. The CyberOptics team looks forward to welcoming visitors at booth 417 in Hall A2 during the event.For more information, please visit www.cyberoptics.com
Booth A1, 341
Scienscope International, a manufacturer of NDT inspection equipment, announces the release of the XT-1000 VMU video coordinate measurement system. The compact economical desktop system features easy to use software with an all-in-one touch-screen PC. Scienscope video measurement systems are specifically designed for non-contact measurement and inspection of small, delicate or complex components. They are the next generation of traditional measuring microscopes and optical comparators.
The XT-1000-VMU features all aluminium chassis design with a 101mm by 203mm, travel stage, one micron resolution encoders, high resolution digital image, the ability to import and export CAD DXF files, Micro-zoom lens with detents, LED top and bottom lighting and more. The easy to use software and ergonomic machine design provides users of all levels quick access for accurate reliable parts inspection. In addition, the system provides image capture and report generation.
WWW.SCIENSCOPE.COM WE SELL SOLUTIONS
A2, 533
Of course, ElectronicWorld Publishing will be attending the show this year – and all are welcome to come and visit.
We’re happy to give demonstrations of our sites, and of course our Electronics Industry Update digital page-turning magazine. We’ll also be offering free subscriptions to our weekly newsletter and to the EIU.
In addition, to discuss editorial and advertising opportunities, simply drop by and ask to speak to the publisher, Donal, who’ll be on hand for the entire show.
To visit our websites, simply got to www.electronicsproductionworld.com
