Publication date: 26 August 2008
The award was presented by Global SMT & Packaging Magazine’s Publisher and Editor-in-Chief Trevor Galbraith during a Tuesday, August 19, 2008 ceremony that took place during the SMTA International exhibition and conference in Orlando, FL.
A fully automated, low-maintenance solution even with high-solids flux, the 2000FP spray fluxing system was designed and developed for manufacturers who run high volume with high product mix. The SonoFlux 2000FP system provides uniform coverage, easy operation and maintenance, and is compatible with all flux types. Additionally, it offers up to an 80 percent reduction in flux consumption.
The system is designed with a high transfer efficiency spray assembly and a closed spray chamber to capture any flux vapor in the environment. The system can be installed internally in the wave solder machine or it can be a stand-alone unit, both with a variety of optional features.
Low maintenance and no operator intervention are the primary features of the SonoFlux 2000FP. Only a monthly cleaning is necessary (even with sticky rosin flux). The system is also equipped with a high velocity flux transfer system to help with PCBs that have difficulty with topside fill, such as those with thick back planes, tight lead-to-hole ratios or contaminated components.
SonoFlux spray fluxing systems, with a stationary, non-clogging ultrasonic nozzle and spray dispensing mechanism have been proven in thousands of industrial PCB fluxing applications worldwide. The 2000FP system contains a wide array of features, making it a powerful, fully automated production tool. It also incorporates an expandable, programmable controller that monitors and controls all system functions.
Additionally, the system has a 1500 recipe storage capacity, network interface capability, automatic width control and the ability to program deposition density. Fluxing parameters are easily changed using a user-friendly operator keypad and LCD display.
Flux is supplied from a closed reservoir by a positive displacement gear pump. The unpressurized flux reservoir (no air/nitrogen required) includes both a filter and a level sensor to protect the pump and alert the operator to a low flux level condition. The flux is atomized into a fine mist at the tip of the non-clogging, large-orifice ultrasonic nozzle where it is then dispersed uniformly by high velocity air jets.
In many installations, SonoFlux systems have a reduced flux consumption by up to 80 percent as well as reducing solder defects by a similar percentage. Compared to foam fluxing, additional savings are achieved by eliminating thinner and titration checks, as well as reduced waste disposal costs. SonoFlux systems have also been shown to reduce flux consumption by up to 50 percent when compared to conventional spray fluxers.
Sono-Tek Corporation prides itself on offering a high level of technical support. North American-based service personnel and international distributors with factory-trained technicians provide this high standard of service throughout the world.
The Global Technology Awards program is sponsored by Global SMT & Packaging Magazine, and is an annual celebration of product excellence in semiconductor packaging and electronics assembly. Premier products based on the finest examples of creative advancement in technology in key areas are chosen by a distinguished panel of global industry experts.
Sono-Tek is a world leader in the development and application of liquid ultrasonic atomization technology nozzle systems and spraying and coating application systems. Compared to conventional pressure spraying methods, the company’s ultrasonic nozzles do not clog, reduce liquid usage, waste, and environmental impact while achieving much more precise, uniform, thin film coatings.
Sono-Tek is continually developing new applications for its unique technology, replacing wasteful practices in a world that is growing ever more environmentally sensitive.
For more information, visit the company at http://www.sono-tek.com.
