New Products / FINETECH to Exhibit High Accuracy Die Bonder at Semicon West 2008

Publication date: 03 July 2008

FINETECH to Exhibit High Accuracy Die Bonder at Semicon West 2008

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 7838 at the upcoming SEMICON West 2008 exhibition, July 15-17, 2008, at the Moscone Center in San Francisco, Calif. This precision bonder is ideal for high accuracy bonding applications, including flip chip, laser bars, VCSELs, MEMS, sensors, RFID, flexible die attach, etc.

The semi-automatic version of the FINEPLACER® Lambda will be on exhibit. This configuration provides automatic touchdown with force control, as well as a temperature/environment controlled bonding operation after manual alignment of die and substrate.

Key features include process reproducibility, patented optics to align large die (up to 40mm) and substrate without reducing the field of view, and up to 10 programmable camera alignment positions.

Bonding processes for the FINEPLACER® Lambda include eutectic soldering, Au/Sn soldering, thermo compression, thermo-/ultrasonic bonding, and adhesive technologies.

About FINETECH

FINETECH is a leading manufacturer of innovative micro assembly and rework equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, Shanghai, China, and Kuala Lumpur, Malaysia.

For Further Information, Please Visit http://www.finetechusa.com