Publication date: 14 August 2008
Among the comprehensive line up of highly successful products on the Mirtec booth will be the MV-3L Desktop AOI System.
This is the “World’s First” Five Camera Desktop AOI system and fully configured provides one top-down camera and four side-view cameras - each providing a native resolution of two (1,600 x 1200) or four mega pixels (2,048 x 2,048) and four side-view cameras with a native resolution of two mega pixels each(1,600 x 1,200).
The system can be configured with a 9.8 micron lens configuration that allows for accurate inspections of components and solder joints down to 01005’s.
The patented “Quad Angle Lighting System” provides four independently programmable zones for optimal illumination of inspection areas.
A powerful new Colour Inspection engine provides additional capability in detecting lifted components, part marking identification and overall component recognition.
The MV-3L features a revolutionary Intelli-Beam Laser System that provides “The Third Dimension in Inspection Capability” — the ability to precisely measure the Z-height of a given region of interest.
This advanced technology provides: Four-point height measurement capability for coplanarity testing of BGA and CSP devices, as well as enhanced solder paste measurement capability and the software, though powerful, is very simple to use.MIRTEC’s latest products also include the MV-7L In-Line AOI system. Fully configured it provides one top-down camera with a native resolution of two or four mega pixels and four side-view cameras with a native resolution of two mega pixels. The system can be configured with a 9.8 micron lens configuration that allows for accurate inspections of components and solder joints down to 01005’s.
The patented “Quad Angle Lighting System provides four independently programmable zones for optimal illumination of inspection areas. A three-stage conveyor system with automatic board support and PCB clamping mechanism is designed for maximum throughput of the line. Precision motion control systems provide absolute reproducibility and repeatability.
The MV-7L In-Line AOI system also incorporates a powerful new Color Inspection engine to provide additional capability in detecting lifted components, part marking identification and overall component recognition all at ultra-high-speeds of up to 4,940 mm2/sec (7.657 in2/sec).
Mirtec’s MV-7L In-Line AOI system incorporates the Intelli-Scan Laser System which has the ability to precisely measure the Z-height of a given region of interest, offering superior lifted lead detection for gull wing devices, four-point height measurement capability for coplanarity testing of BGA and CSP devices, and enhanced solder paste measurement capability.
An optional Side Viewer® Camera System provides four additional Two Mega Pixel Side View Digital Color Cameras for enhanced detection of lifted leads and lifted components. This system also provides solder joint inspection of J-leaded and LCC devices.
MIRTEC’s MV-7xi In-Line AOI system will also be highlighted at the Nepcon Show. Fully configured it provides all the capabilities and options of the MV-7L. This new system is able to inspect PCB sizes up to 20” x 18” (510 x 460 in mm) and all within a very compact footprint of 3.3 ft (1,000 in mm). This System can be configured with all options, including 4 mega top down camera, side-view cameras, Intelli-Scan Laser, and an NG marking system.
MIRTEC will also showcase the MV-6L In-Line AOI system. Fully configured the MV-6L provides one top-down camera with a native resolution of two mega pixels (1,600 x 1,200) and four side-view cameras with a native resolution of two mega pixels (1,600 x 1,200).
The MV-6L also has the optional Intelli-Scan Laser System, which has the ability to precisely measure the Z-height of a given region of interest, offering superior lifted lead detection for gull wing devices, four-point height measurement capability for coplanarity testing of BGA and CSP devices, and enhanced solder paste measurement capability, an industry first, and unique to only MIRTEC. The MV-6L also has the flexibility of being used separately as a laser based inspection tool or vision based inspection tool.
Finally, MIRTEC will demonstrate the MX-9C X-Ray Inspection System. This system is utilized for the automatic detection of defects in BGAs and CSPs. This system excels by providing real time X-Ray Inspection with a simple yet powerful user interface. Among its many features is the ability to display multiple images, and allow the inspector to easily edit these images for fast and reliable results.
For Further Information, Please Visit http://www.mirtecusa.com
