Publication date: 12 August 2010
The production of key products such as color TVs, mobile phones, electronics components and ICs in China continues to rise, which makes Shenzhen’s electronics information industry amongst the most important in the country. The output value of the city’s electronics manufacturing sector in the first quarter of 2010 was RMB 204.6 billion (USD 30.2 billion). This represents an increase of 18.6% year on year. A growth rate that outstrips that of other large and medium-size cities in China.
Shenzhen is a vital commercial hub. It is an important channel for import, export and international purchase. It is also where domestic and foreign buyers regularly convene. The 16th NEPCON South China event will open at the Shenzhen Exhibition Center on August 31, 2010. NEPCON is about satisfying the growing requirements of the electronics manufacturing industry in China.
The Electronics Assembly and Packaging Technology Expo 2010, which will take place alongside NEPCON South China 2010, will feature various products and technologies related to electronics assembly and packaging devices. Because these will be more specialized, systematic and of higher performance than their predecessors, they will be the ideal solution for companies looking to enhance productivity, effect lean manufacturing and cut costs. NEPCON South China is one of the largest and most comprehensive platforms in the electronics manufacturing trade and has the longest history across Southeast China’s SMT industry.
This show will have an exhibition area of 30,000 sqm and attract over 500 exhibitors from 22 countries and regions. An additional 25,000 industry leaders and buyers will also be on-site to view a comprehensive display of over 1,000 types of electronics manufacturing devices, test and measurement products, as well as related components and consumables for industry visitors.
Currently, semiconductor LED technology is the main energy-saving technology in China. It has been integrated into the national middle- and long-term science and technology development plan. It is also now part of the major “863” projects for high-tech industrialization, according to the 11th five-year plan. In 2008, the LED market output in China reached USD 8 billion, with an average annual increase of 20%-30% over several years. As the application scope of LED expands, it is expected that the LED market output in China will exceed RMB 150 billion (USD 22.1 billion) up to 2010. LED companies in Shenzhen account for most of the market output and covers the majority of the industry chain.
Green Lighting Shanghai 2010, jointly organized by Reed Exhibitions and the CSA, was held in April 2010. Here, exhibitors from the LED field drew extensive attention from visitors to NEPCON. Because South China is home to the country’s most important LED industry base, NEPCON South China 2010 will continue to invite manufacturers of LED backlight modules, LED displays, LED lighting and LED lamps to visit and develop partnership opportunities on-site.
As it recovers from the global financial crisis, the manufacturing industry in China is growing quickly. However, since the 2010 Spring Festival, labor shortages have become acute. Whereas in the past this problem only affected coastal areas, it has now spread to the inland too. This means that the era of the electronics assembly and packaging industry profiting from cheap labor is over.
As companies continue to strive to enhance the technical devices they produce and improve product quality, the number of personnel can be reduced through greater automation of the production line. Consistent quality can be realized by reducing the cost of labor i.e. increasing investment in automation. Companies should focus on replacing manual labor with machines to raise the productivity and increase profit through improved product quality and additional value. This will allow for technical upgrades and strengthen the competitive power of the entire industry.
The Electronics Assembly and Packaging Technology Expo 2010 will serve several functions. It will:
• drive the development of automation technology; • identify marketing opportunities for members of the industry;• facilitate information exchange;• serve as an efficient transaction platform;• promote market requirements and • provide strong support to both exhibitors and visitors.
Kilews, Federal, Dalsa, Tselec, Dongguan Sumeida, Fukucima and Collector are among the industry leaders who will attend this exhibition. And as more and more NEPCON exhibitors explore the new solar energy industry, so too will Reed Exhibitions. The Solar Cell and Equipment Manufacturing Technology Summit, co-held by Reed Exhibitions, Shenzhen Solar Energy Society and the Institute for Solar Energy Systems (ISES), will be attended by experts in the solar PV sector who will discuss solar cell processes, equipment manufacturing technologies, policies and regulations, among a range of topical issues. Production devices and prevailing technologies applied in manufacturing including machine vision, laser processing and barcode technologies will also be on display at the show.
Taking advantage of the platform provided by Reed Exhibitions, numerous high end industry symposiums will be held concurrently, to examine topics that will include state-of-the-art technologies in SMT, novel energies and automotive electronics manufacturing. SMTA China will organize the SMTA South China Conference, to primarily discuss electronics manufacturing, advanced packaging technology and lead-free technology. The Mobile Phone Manufacturing Forum, the Lead-Free Alliance Annual Conference, the Automotive Electronics Forum and other events will be where further discussion on topics of interest to the entire spectrum of visitors and guests can be discussed. SMTe Members Interaction, The Fifth Anniversary Conference of GDSMT and the Engineers Salon and SMT Family Members Meeting will also be held then.
Exhibitors introduce new or upgraded products and technologies at NEPCON every year. This year, leading local and international companies like Meiya Electronics, Assembléon, Tokyo Juki International Trading, Baodi Electronics, Panasonic, Sony, Senju, Henkel Loctite, Omron, Saki and WKK, will continue this fine tradition, thereby demonstrating their support for and faith in NEPCON.
The Fuji NXT II modular placement machine uses the a linear motor driving system; works with a high performance CPU/servo system and uses a module with a higher-strength structure and new placement head design. Together, these aspects combine to deliver more stable high-speed production and increase capacity by 30%. The true modular method can combine modules, working heads and feeding stations freely, producing the best machine configuration under any production environment. One-key installation and removal of working heads, automatic calibration of machines and high-speed intelligent feed bars can supply materials endlessly and display outage warnings. The graphic user interface can ease operation. It is equipped with Fujitrax quality management systems and can prevent operators from feeding incorrect materials while also providing the highest ever level of traceability.
The AX501 placement platform, equipped with double placement modules, is an original Assembléon solution. It supports high velocity, high-quality placement of flake-shaped chip elements on a single machine - especially for placement of memory module products. Its configuration can be changed to adjust the placement speed at 6,000 placement points per hour. It can reach up to 111,000 points per hour (IPC standard). DPM is up to one digit and can place components ranging from 01005mm to 45mm x 45mm and the height can be up to 12mm. It consumes about 50% less electricity than similar products. It is truly environment friendly and efficient.
• The electronics part placement machine SI-G200MK5. It can perform at a rate of up to 66000cph. It has an automatic feeder of solder paste, as well as a solder paste press that is equipped with a high-speed cleaning device and greatly reduces cost. • The 3-D solder paste-inspecting machine SI-V200SPI. This can perform 2-D and 3-D inspection• An SMT production line. This is applicable for large substrates placement such as LED substrates.
Henkel Loctite will feature its Multicore® HF108, a kind of halogen-free and lead-free solder paste. It has excellent high-speed printing capabilities. Its service life, under normal temperature conditions, is four weeks. It has a wider process window. The Multicore® HF108 also passes the strict oxygen and nitrogen burning/ion chromatography analysis test.
Gaoyong Technology will display aSPIre 2. This is the only 3-D solder paste printing inspection device that completely solves the current device measurement problem and reports 3-D inspection data accurately.
Tokyo Juki International Trading will introduce their high-speed modular placement machine FX-3 for the 800mm LED substrate and their ingenious high-speed and high-performance placement machine JX-100 LED. It will also exhibit new products like the KE-3020, a high-speed general placement machine that can be used as an electromotive and mechanical feeder. Also the KE-1080 that has an improved performance-price ratio. The much-anticipated modified placement support system and the suction/placement monitoring system will also be on show.
The I-Pulse M6e series, launched by Po Lik Mechanical Equipment Company, is a new product that combines miniaturization capabilities, flexibility and high performance. It is especially suitable for the changing domestic market and enables users to make flexible choices according to their own requirements. It has a bidirectional flying spot scanning method, which enables scanning of the largest substrate up to L460mm x W410mm and a placement of 01005mm - 54mm. There are 120 types of feeders, all of them with the 8mm feeding belts used for intelligent feeders.
The Autolink depanelization machine’s CCD image system from Dongguan Autolink Automation Equipment can effectively recognize marked points and automatically compensate the difference between the X and Y axes in a 5.5mm x 5.5mm window. This increases the PCBA division accuracy and simplifies operation. The double work station can cut different shapes and PCBA with different heights. It has several functions in one machine and allows for improved efficiency and capacity.
NEPCON is a large-scale, truly international electronics manufacturing event. Taking advantage of the resource platform established by NEPCON and its wide influence will encourage information exchange and foster communication on technical issues among key members of the electronics manufacturing industry. Buyers can reap extensive professional rewards by being part of NEPCON. Visitors, too, can get an immediate insight into market trends, as they learn about emerging innovations.
