Publication date: 25 August 2008
The award was presented by Global SMT & Packaging Magazine’s Publisher and Editor-in-Chief Trevor Galbraith during a Tuesday, August 19, 2008 ceremony that took place during the SMTA International exhibition and conference in Orlando, FL.
Polyonics XF-546 is a polyimide label material with a permanent, pressure sensitive, silicone adhesive and a high opacity, medium gloss white topcoat specifically designed for thermal transfer printing. The printed polyimide labels withstand long-term temperature exposure as well as higher short-term temperatures (up to 10000F (5380C)) better than standard polyimides or other high temperature synthetic labels.
Surviving temperatures allows XF-546 to work better in today’s changing PCB and component multi pass processing without failing thus eliminating the need for reprinted or replaced labels and increasing manufacturing speeds.
XF-546 is RoHS/REACH compliant and approved for lead-free applications. Each polyimide label produced has excellent resistance to harsh fluxes, cleaners, saponifiers, and wave solder environments, and resists all commonly used methods of cleaning. When matched and printed with the appropriate ribbons XF-546 resists smearing and provides excellent first read rates when scanned.
The Global Technology Awards program is sponsored by Global SMT & Packaging Magazine, and is an annual celebration of product excellence in semiconductor packaging and electronics assembly. Premier products based on the finest examples of creative advancement in technology in key areas are chosen by a distinguished panel of global industry experts.
For Further Information, Please Visit http://www.polyonics.com