Publication date: 21 August 2008
The Semiconductor Applications Center represents a multi-million dollar investment that further enables Enthone to deliver customer-driven solutions to the dynamic wafer fabrication marketplace.
Technologies supported at the Center include the company’s MICROFAB® bump wafer processes and ViaForm® wafer deposition electrodeposition technologies, including damascene copper, through silicon via (TSV), copper redistribution layer (RDL), copper post, and lead-free bump applications.
Raymond Fong, Vice President and Managing Director – Enthone Asia said, “Taiwan represents over 65% of the world’s semiconductor foundry manufacturing, as well as 60% of the world’s semiconductor packaging market.
The Center is strategically located to further support and collaborate with these world leaders on new and emerging technologies as they advance their product portfolio, and implement higher performance, more cost-effective wafer manufacturing throughout the Asia-Pacific region and across the globe.”
The Center is staffed by Enthone’s team of applications experts and is designed to accommodate the stringent needs of the semiconductor market. Currently, the Center provides wafer sample plating and testing for process optimization, bath composition analysis, and characterization of plated features and deposits for bump height, morphology, post-reflow inspection, alloy composition, thin film thickness and SEM cross-sectioning for filling.
“The Enthone Semiconductor Applications Center provides our team of applications engineers and R&D chemists a unique opportunity to partner with our customers, while gathering critical feedback to validate and further optimize their manufacturing process.” said Michael Corey, Global Business Director – Enthone Electronic Materials Group.
Enthone Inc. is a business of Cookson Electronics. The company is a leading supplier of high performance specialty chemicals and coatings used in the electronics and surface finishing industries. Enthone manufactures, markets and distributes its functional, decorative and electronic processes that are used in printed wiring board, semiconductor, photovoltaic, automotive, aerospace, jewelry, and plumbing applications.
Cookson Electronics is a leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide. The company delivers superior value by providing truly differentiated products, services and support through its Alpha, Enthone and Cookson Electronics - Semiconductor Products businesses.
For more information, please visit http://www.cooksonelectronics.com.
