Upcoming Training - Temperature Profiling & Reflow Soldering Lead-Free - 22nd June,2010

Publication date: 12 June 2010

Temperature Profiling & Reflow Soldering Lead-Free
Date:Tuesday, June 22, 2010
Time:14.30
Cost:£65.00

Details:

Electronics Production World and BobWillisOnline.com collaborate to bring you live online training for Electronics Manufacturing.

This course provides a better understanding of solder paste reflow soldering in modern manufacture. Only the correct selection of solder paste and reflow parameters along with a correctly designed assembly can provide reliable solder joints. The course aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of reflow. The key feature of the course focuses on how to correctly profile a printed board assembly with convection and vapour phase and demostrating the tricks of the trade and the pitfalls of poor profiling

Presented by Bob Willis

PCB assembly processes requiring profiling
Selecting the correct thermocouple
Mounting thermocouples
Measuring systems
Impact of design on profiling
Component type and thermal demand
Temperature profiles for adhesives, soldering & curing
Process defects associated with incorrect profiling

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