Publication date: 08 May 2008
Focusing on next generation technologies in design, fabrication and assembly, the IPC technical seminars will take place June 17–19, 2008 at Earls Court, London.
IPC presents an international team of instructors to lead 15 full- and half-day courses designed to offer attendees insight on board and assembly production at lowest cost, innovations in advanced packaging, and the latest developments in lead-free reliability, process troubleshooting and more.
Achieving High Reliability for Lead-Free Solder Joints - Material Considerations, Ning-Cheng Lee, Ph.D., Indium Corporation of America
Designing PCBs for Lowest Cost - Reducing Layers and Other DfM Principles, Happy Holden, Mentor Graphics
Surface Mount Technology: Principles & Practice in a Lead-Free World, Ray Prasad, Ray Prasad Consultancy Group
Updating Rework and Repair for Lead-Free, Barry Morris, ART— Advanced Rework Technology
Lead-Free Reliability for Harsh Environment Electronics, Jennie Hwang, Ph.D., H-Technologies Group
Design for Reliability, Reliability Testing & Data Analysis, and Failure Analysis of Lead-Free Solder Joints, John Lau, Ph.D., Institute of Microelectronics
What is HDI? Do you Need HDI? How to Get Started, Happy Holden, Mentor Graphics
Lead-Free BGA Reliability in Packaging and Assembling, Jennie Hwang, Ph.D., H-Technologies Group
Ball Grid Array: Principles and Practice, Ray Prasad, Ray Prasad Consultancy Group
Stencil Printing Process for Solder Paste Application: An In-Depth Look, S. Manian Ramkumar, Ph.D., Rochester Institute of Technology
Reliability Issues with Lead-Free Soldering Processes, Werner Engelmaier, Engelmaier Associates L.C.
True Design for Reliability: Understanding What Is and What Is Not DfR, Craig Hillman, Ph.D., DfR Solutions
Advanced Component Packages – An Introduction Including Lead-Free Implementation, S. Manian Rumkumar, Ph.D., Rochester Institute of Technology
Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias (PTHs/PTVs), Including Lead-Free Soldering Impact, Werner Engelmaier, Engelmaier Associates L.C.
Understanding Failure and Root-Cause Analysis in Lead-Free Electronics, Craig Hillman, Ph.D., DfR Solutions
Speaking on IPC’s commitment to deploy and transfer technology on a global basis, IPC President Denny McGuirk said, “We are thrilled to bring technical expertise and experience closer to our 330 European corporate members — and the entire electronics community. IPC is poised to lead the electronics industry into next generation technologies and we believe NEW is an excellent platform to keep the industry informed of the latest trends.”
Full IPC seminar descriptions are available at www.ipc.org/IPC-UK. For more information, contact Anne Marie Mulvihill, IPC program manager for professional development, at +1 847-597-2827.
To register, visit http://www.ipc.org/NewReg08.
For complete event information, go to http://www.nationalelectronicsweek.co.uk
IPC (http://www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly.
As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
