Electronics Production World

Webinars and Online Training

Article title     

Upcoming Webinar - BGA X-Ray and Optical Inspection Criteria

Area Array Technology is part of mainstream electronics but until recently very little inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for tin/lead alloys but with the move to lead-free assembly, new QFN and LGA packages there are critical issues to consider during inspection.

Upcoming Webinar - BGA Dye & Pry Inspection - How to Do It?

Today the most common methods of inspecting solder joints on Ball Grid Array (BGA), Chip Scale Package (CSP) or Flip Chip is X-ray or side view inspection using a fiber optic system. Each has its advantages and disadvantages but a combination of both is ideal provided you can justify both pieces of process equipment.

Upcoming Webinar - Guide to PCB Solder Finishes & Process Defects

The choice of solderable finishes applied to surface mount boards can have a significant effect on the assembly yield, bow and twist, misplacement, open joints and cost of the final circuit. Tin/lead and lead free solder levelled board are in the minority gold, tin, silver and OSP have been growing in popularity but nothing solders like solder!!

Upcoming Webinar - Package on Package (PoP) Assembly Process & Inspection

Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. This event is sponsored Nordson DAGE

Upcoming BGA X-Ray and Optical Inspection Criteria Webinar

Area Array Technology is part of mainstream electronics but until recently very little inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for tin/lead alloys but with the move to lead-free assembly, new QFN and LGA packages there are critical issues to consider during inspection.

Upcoming Online Training - PCB Assembly & Component Failure Analysis - How to do it?

Different levels of failure analysis exist, from the very basic with virtually no equipment, to the use of a full failure analysis laboratory. Often simple analysis methods can point engineers in the right direction, but proving the root cause of failure often needs the electronic pathologist with all his investigation tools. When conducting any failure analysis it is important the results prove the cause of the fault. The true reason for failure needs to be clear and proven with hard facts, not just opinions.

Upcoming Online Training - Printed Board Inspection & Quality Control

Printed circuit boards are the foundation, the building blocks, for all modern electronic products. The long term quality and reliability of any product is determined by the quality of the substrate

Upcoming Training - Temperature Profiling & Reflow Soldering Lead-Free - 22nd June,2010

The course provides a better understanding of solder paste reflow soldering in modern manufacture. Only the correct selection of solder paste and reflow parameters along with a correctly designed assembly can provide reliable solder joints. The course aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of reflow. The key feature of the course focuses on how to correctly profile a printed board assembly with convection and vapour phase and demostrating the tricks of the trade and the pitfalls of poor profiling