New Products

The electro-chemicals manufacturer, Electrolube, holds environmental responsibility at the core of its ethos so when the opportunity came to utilise a low global-warming-potential (GWP) propellant in some of its key products, the company quickly recognised the benefits this would create for its customers and the environment, without any compromise in performance.

The new modular plastic belt conveyor system from FlexLink is the efficient solution for the transportation of large individual items and flows of smaller products.

First, PCB manufacturers are switching to Tin Copper (SnCu) solder in wave soldering process’s as a cost cutting measure and moving away from silver based alloys. The Tin Copper alloy has a higher melting point which requires temperatures up to 280°C for processing. This increase in temperature may cause yellowing of the label or adhesive failure. If the label turns yellow it may not scan properly or may not be accepted for aesthetic concerns.

The Rainbow Process represents a breakthrough for the electronics industry by incorporating coating, imaging and developing of PCBs in one compact, automated unit which promises to make board production faster, easier and more profitable.

New technologies such as package on package (PoP) component assembly or bare die assembly on COB applications, as well as the optimization of material consumption demands for increased knowledge of the actual placement forces.

Tanaka Kikinzoku Kogyo K.K. (*1) (a company of Tanaka Precious Metals) announced that it had succeeded in the joint development of ruthenium material able to form a film up to six times the normal depth for capacitor electrodes used in semiconductor memory DRAM (Dynamic Random Access Memory) with Professor Seiji Ogo of the Graduate School of Engineering Department of Applied Chemistry at Kyushu University.

GOEPEL electronic introduced PXI 1149/DAK, a mass interconnect interface within the frame of the technologically leading JTAG/Boundary Scan hardware platform SCANFLEX®. The new option for the SFX/PXI1149/Cx controller are compatible with SCOUT, the mass interconnect system from MAC Panel. Using this option, the customer can now easily combine JTAG/Boundary Scan with the PXI connectivity solution from MAC Panel.

Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.

Ascentech LLC, the North American distributor for GEN3 Systems Ltd., will introduce and exhibit Gen3’s the new CM – Series Large-Format Ionic Cleanliness Test System, the first of its kind, at IPC/APEX 2012 in San Diego, California, February 28 – March 1, 2012, in Booth #617.

Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond EP3HTSMED epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and fully meets USP Class VI requirements for medical applications.

KIC will debut the Reflow Process Index (RPI) in Booth #2428 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

JBC Tools, Inc., a leading provider of hand soldering and rework tools, introduces new cartridges for special soldering jobs.

Cognex Corporation (NASDAQ: CGNX) today introduced its most advanced fixed-mount industrial ID reader ever created — the DataMan® 300. The DataMan 300 is designed to handle the most difficult ID code-reading applications on even the highest speed lines.

Smart Sonic proudly announces that 440-R® SMT Detergent is the only VOC-free stencil cleaning chemistry! All other chemistries designed for cleaning solder paste from SMT stencils contain hazardous VOCs (Volatile Organic Compounds).

ACE Production Technologies will exhibit the next-generation KISS-205 fully in-line automated Selective Soldering system, recently introduced to the market. The KISS-205 effectively splits the process of fluxing, pre-heating and soldering to significantly gain productivity by reducing TAKT by up to 50% vs. incremental processing.

Technic Inc. has announced the release of Technic EN AT5600, an electroless nickel developed specifically to eliminate black pad and to improve soldering on ENIG coated PCBs. Technic EN AT 5600 is the first electroless nickel that provides lateral growth on copper, yielding a flatter surface with less pronounced grain boundaries instead of the typical nodular, “cauliflower-like” structure from older formulas.

JBC Tools, Inc., a leading provider of hand soldering and rework tools, introduces the PH Infrared Preheater. The PH Preheater is streamlined, easy-to-use and packed with features. Additionally, it perfectly complements the rest of the JBC product line.

Compact, precise and exceptionally easy to use: These are the characteristics of Fino, the new printer from Essemtec. The programmable precision printer can be placed on a table, making it is ideally suited for smaller, flexible production. Optionally, the printer is available mounted on a robust steel stand.

The preeflow® eco-PEN 600 from Intertronics takes all the features of the eco-PEN 300/450 and adds size – maximum volume is nearly trebled at 16 ml per minute while minimum dose is just 0.015 ml, thus increasing the application scope of these high precision volumetric dispensing systems, as well as enabling them to take on the bigger jobs where guaranteed 1% accuracy is required with continuous repeatability such as with robotic installations in electronics, component assembly, medical or laboratory type industries.

The Production Systems Division (PSD) of Hitachi High Technologies America, Inc. (HTA), will exhibit equipment and software solutions for today’s electronics manufacturing industry challenges at IPC/APEX 2012 in Booth #2440. IPC/Apex 2012 Conference and Exhibition takes place February 28 – March 1 at the San Diego Convention Center, San Diego, California. HTA is a global leader in advanced instrumentation and electronics manufacturing and assembly equipment.